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    • 专利摘要:
    light emitting device and method for manufacturing a light emitting device. it is a light-emitting device (1) having: a plurality of light-emitting elements (10, 20, 30, 40, 50), a base (2, 12, 22a, 22b, 22c) having a first main surface and a second main surface on the side opposite the first main surface, wherein the base has conductive patterns (3a, 3b, 33a, 33b) disposed on the first main surface on which the light-emitting elements are mounted, patterns conductors arranged on the second main surface, and a channel (2, 2b, 12a) provided in the second main surface of the base that corresponds to a space between the light-emitting elements, and a light-reflecting member (5) that integrally covers the side surfaces of the plurality of light-emitting elements.
    公开号:BR102015015082B1
    申请号:R102015015082-2
    申请日:2015-06-22
    公开日:2021-08-10
    发明作者:Tomonori MIYOSHI；Kenji Ozeki
    申请人:Nichia Corporation；
    IPC主号:
    专利说明:

    BACKGROUND FIELD OF TECHNIQUE
    [001] The present description refers to a light-emitting device that has a plurality of light-emitting elements. RELATED TECHNIQUE
    [002] Because they have good directionality and high luminance, semiconductor light-emitting elements have been used in the past not only in lighting light sources that served as alternatives to fluorescent lamps, but also as light sources in signaling devices, display devices for use in transport, display devices that are mounted outdoors, and headlights on vehicles.
    [003] In a known light-emitting device in which a semiconductor light-emitting element such as this is used, the light-emitting element is mounted on a board that has wiring. For example, with the light emitting device proposed in JP2009-212134A, aluminum nitride, which has good heat dispersing properties, is used in a package plate, and this aluminum nitride plate includes a front electrode and a back electrode that are electrically connected by a pathway that passes through the board.
    [004] On the one hand, there is a recent need for a light emitting device to provide high luminance, but, depending on the application, there is also a need for very small light emitting devices in which the emission surface area is decreased, from in order to facilitate the light distribution project. To this end, chip-size packaging (CSP) in which the planar size of the packaging is approximately the same as that of a light-emitting element have been developed for some years now. In addition, there is a need for a plurality of CSPs to be mounted, in high density, on a mounting plate to facilitate light distribution design. SUMMARY
    [005] The present description refers to a light-emitting element. The light emitting device has a plurality of light emitting elements, a base having a first main surface and a second main surface opposite the first main surface, wherein the base has conductive patterns disposed on the first main surface over the which light-emitting elements are mounted, conductive patterns arranged on the second main surface, and a channel provided in the second main surface of the base that corresponds to a space between the light-emitting elements, and a light-reflecting member that covers integrally the lateral surfaces of the plurality of light-emitting elements.
    [006] The present description refers to another light-emitting element. The light-emitting device has: a plurality of light-emitting elements, a plurality of bases, each of which has a first main surface and a second main surface on the opposite side to the first main surface, wherein each of the bases has a conductive pattern disposed on the first main surface on which the light emitting elements are mounted, at least one base having a heat dissipation pattern disposed on the second main surface, a light reflecting member integrally covering the side surfaces of the plurality of light-emitting elements, and conductive members that electrically connect the conductive patterns disposed on the plurality of bases.
    [007] Additionally, the present description refers to a method for manufacturing a light emitting device. The method comprises providing a base having a first main surface and a second main surface on the side opposite the first main surface, on which base has conductor patterns disposed on the first main surface, conductor patterns disposed on the second main surface, mounting a plurality of elements light-emitting elements in the conductive patterns on the first main surface, form a light-reflecting member that integrally covers the side surfaces of the light-emitting elements, and form at least one channel in the second main surface of the base to correspond to a space between the light-emitting elements.
    [008] With the light emitting device relating to an embodiment of the present invention, a plurality of CSPs are arranged evenly and with the smallest possible spacing, while still providing a reliable light emitting device that has good dissipation heat and no joint defects or the like. BRIEF DESCRIPTION OF THE DRAWINGS
    [009] Fig. 1A is a simplified plan view of the light emitting device in Modality 1 of the present description;
    [0010] Fig. 1B is a simplified cross-section along line A A' in Fig. 1A;
    [0011] Fig. 1C is a simplified cross-section showing the state when the light emitting device in Fig. 1A is mounted on a mounting plate;
    [0012] Fig. 2 is a simplified cross-section of the light emitting device in the Modality 2 of the present description;
    [0013] Fig. 3 is a simplified plan view of the light emitting device in Modality 3 of the present description;
    [0014] Fig. 4A is a simplified plan view of the light emitting device in Embodiment 4 of the present description;
    [0015] Fig. 4B is a simplified plan view showing an internal structure of the light emitting device in Embodiment 4 of the present description;
    [0016] Fig. 4C is a simplified cross-section along line A A' in Fig. 4A;
    [0017] Fig. 5 is a simplified cross-section of the light emitting device in the Modified Modality of the present description; and
    [0018] Figures 6A to 6E consist of simplified cross-sectional step diagrams illustrating the method for manufacturing the light emitting device in Mode 1. DETAILED DESCRIPTION OF THE INVENTION
    [0019] The inventors carried out meticulous research aimed at developing a light-emitting device that is small, thin, and offers extremely high luminance. As a result, it was found that when a plurality of light emitting devices are mounted in high density on a mounting plate, and especially when the size of the light emitting devices is very small, arrange them so that they are spaced apart. evenly, with no gap, demands an extremely high level of precision, which is difficult to achieve. On the other hand, it has been found that when a light-emitting device, in which a plurality of light-emitting elements are mounted in high density on the same base, is mounted on a mounting plate, the heat cycle load during or after the mounting on a mounting board or on a circuit board using a junction member causes the separation of the junction member due to the difference in the coefficient of linear expansion between the substrate and the mounting board, which leads to discontinuity of the wiring, short circuit, and the like. This phenomenon is particularly accentuated when the base of the light emitting device is larger. In view of this, the present invention has been improved by finding that even with a light emitting device with high luminance and a relatively small size, reliability can be improved by effectively absorbing or releasing the thermal expansion and contraction between the light-emitting element, the base, the joining member, the mounting plate, and so on, caused by the heat cycle.
    [0020] The sizes and disposition relationships of the members in each of the drawings are occasionally shown exaggerated for ease of explanation. Additionally, in the description below, the same designations or the same reference numerals may, in principle, denote the same or similar members, and duplicate descriptions will be appropriately omitted. In addition, constitutions described in some of the examples and modalities can be employed in other examples and modalities.
    [0021] In the specification, the term "top", "bottom", "first main surface" and "second main surface" also mean a light extracting face side and the side opposite the light extracting face side, respectively. For example, the top surface and the first main surface are the light extracting face of the light emitting device, while the bottom face and the second main surface are the opposite side to the side mentioned above.
    [0022] The light-emitting device in this embodiment includes a base having a conductive pattern, a plurality of light-emitting elements mounted on the conductive pattern, and a light-reflecting member integrally covering the side surfaces of the plurality of light-emitting elements.
    [0023] The base, light-emitting elements and light-reflecting member generally constitute a single light-emitting device. This light-emitting device has a channel on the second main surface thereof, between the light-emitting elements. BASE
    [0024] The base is used to mount a plurality of light-emitting elements and includes a first main surface on which the light-emitting elements are mounted, and a second main surface on the opposite side to that first main surface.
    [0025] This base is known in this field, and any base that is used for mounting light-emitting elements and the like can be used here. The base is usually composed of a conductive pattern and a base body that supports it. Examples of the base body material include glass, epoxy resin, ceramic (HTCC, LTCC), and other such base bodies composed of insulating materials, and metal members and the like in which an insulating member has been formed. Of these, one that has good heat resistance and weatherproofing and one that has high thermal conductivity is preferred. For example, one with a thermal conductivity of about 20 W/m^k or higher is preferable, 30 W/mrk or higher is more preferable, 50 W/mrk or higher, or 100 W/m^k or taller is even more preferable. It is particularly preferable that the base body is formed of an insulating material whose thermal conductivity is higher than that of the light-reflecting member (discussed below). For example, whose thermal conductivity is preferably at least 2 W/mrk higher, at least 3 W/m^k higher, at least 5 W/m^k higher, or at least 10 W/m ^k higher than that of the light-reflecting member. The use of such a base body allows heat generated from the light-emitting elements to be efficiently dissipated.
    [0026] More specifically, it is preferable to use a ceramic. Examples of ceramics include alumina, aluminum nitride and mullite. These ceramics can be combined with a BT resin, epoxy glass, an epoxy resin, or other similar insulating material.
    [0027] The thickness of the base body is generally from about 100 µm to about 1 mm. When the heat dissipation and electrical contact of conductive patterns on the first main surface and second main surface are taken into account, about 300 to 700 µm is preferable.
    [0028] The base has at least one channel on the second side of the main surface which is the opposite side to the first main surface, which corresponds to a space between the light-emitting elements. This channel can be formed only in part of the thickness direction of the base body of the second side of the main surface, or it can be formed to a depth that reaches to the side of the first main surface from the second side of the main surface, i.e. , at a depth reaching as far as the side of the first main surface from the second side of the main surface. That is, the base has a partial channel while the light-emitting elements are assembled, and the channel can be integrally connected to the base without reaching the side of the first main surface, or the channel can be formed to a depth that reaches the side of the first main surface, so the base can be divided by the channel into a plurality of segments. In other words, the base constituting a single light emitting device can be a single member with at least one channel formed on the second side of the main surface, or a plurality of flat bases can be arranged with uniform spaces therebetween. In this descriptive report, a channel is formed to a depth that reaches to the side of the first main surface, that is, the space between bases when the base has been divided will also be described as a "channel."
    [0029] In any case, since a plurality of light-emitting elements is mounted on the side of the first main surface of the base, and the side surfaces of these light-emitting elements are covered by a light-reflecting member (discussed below), the base, the light-emitting elements and the light-reflecting member are configured as an integral light-emitting device.
    [0030] The channel width is preferably wide enough to absorb or release expansion and contraction, etc., of the base itself, which includes the conductive pattern and/or base body due to the cyclothermal, taking into account the generation and dissipation of heat by and from the light-emitting elements. More specifically, an example is a width of about 10 to 200 µm and preferably about 100 µm.
    [0031] From the same perspective as above, the width of the spaces between which a plurality of bases is arranged across the spaces may be equivalent to the width of the channels mentioned above.
    [0032] The channel depth is preferably the same as the base thickness, and when it is less than the base thickness, an example is at least 50%, at least 70%, at least 80%, at least 90%, at least 98%, or 100% of the total thickness of the base body, depending on the type and thickness of the base body. The connection in the thickness direction of the base body is preferably sufficient to allow the base body to be divided by the tension generated by the aforementioned expansion and contraction of the base body itself. Consequently, when this tension is applied, the base body can be intentionally detached so that the tension is effectively released.
    [0033] The channel can be formed by a method known in the field, such as laser processing, tracing or dicing with a blade.
    [0034] The base has the base body and a conductive pattern. The conductive pattern is preferably disposed on both the first main surface and the second main surface. Furthermore, it can be arranged on a side surface adjacent to both the first main surface and the second main surface. Alternatively, a pathway may be formed which extends to both the first main surface and the second main surface, i.e. which traverses the base body. This electrically connects the conductive pattern of the first main surface to the conductive pattern of the second main surface. The "first main surface" here means the face on which the light emitting elements are mounted, and the second main surface opposite the first main surface is the face opposite the emitting surface of the light emitting device.
    [0035] As discussed above, when the conductive pattern is disposed on the base body in which the channel is formed, this conductive pattern may also be split with the base body. The conductive pattern is preferably disposed on both the first main surface and the second main surface of the base body, a first conductive pattern on the first main surface and a second conductive pattern which is located directly under the first conductive pattern and is disposed over the second main surface and the two are electrically connected, but all conductive patterns may not be electrically connected. Furthermore, the conductive patterns can be arranged so that they can function as a pair of terminals that correspond to a single light-emitting element. Furthermore, the conductive patterns can be arranged so that a plurality of light-emitting elements can be independently actuated by power supply control or the like, or it can be arranged so that a plurality of light-emitting elements can be triggered together. Independent triggering is known in this field, and any commonly used configuration and method can be used. When the conductive pattern is not disposed on the first main surface of the base body where the channel is formed, or the conductive pattern is disposed on the base body and that conductive pattern is divided, a plurality of conductive patterns in which a plurality of emitter elements of light is mounted respectively can be electrically connected by a conducting member so that the elements are driven all together. Examples of the conductive member include a wire, a conductive tape, a conductive silicone paste or other similar conductive material.
    [0036] Because the base has at least one channel, the electrical connection to the light-emitting device mounting plate can be guaranteed even when a single light-emitting device having a large emitting surface, in which a plurality of light-emitting elements light are arranged, is mounted on the mounting plate. That is, even if the mounting plate expands or contracts due to heat generated by individual light-emitting elements, thermal hysteresis during mounting, or other factors like this, this voltage can be dispersed and released by the base channel. As a result, joint defects such as joint separation caused by the expansion and contraction inherent in the materials that make up the light-emitting elements, the base, the joint member, and so on can be effectively prevented.
    [0037] The channel width is, for example, approximately the thickness of the base, or less and preferably not more than half the thickness of the base and more preferably not more than a quarter of the thickness of the base. When the mounting plate has a curved surface, then at least one-tenth is even more preferable.
    [0038] The channel may not be arranged between all light-emitting elements. For example, when the light-emitting elements are arranged in a matrix, the number and shape of the channels (such as forming the channels in only one direction) can be properly selected according to the type and size of the base and the emitting elements of light. As an example, the channel can be formed in only one direction. LIGHT EMITTING ELEMENT
    [0039] The light emitting element 1 is generally a light emitting diode. The composition, emission color and wavelength, size, quantity, and so on of the light-emitting elements can be properly selected according to their intended purpose. For example, ZnSe, a semiconductor nitride (In-XAlYGa1-X-YN, 0<X, 0<Y, X+Y<1), GaP or other similar semiconductor layer can be used as blue and green light emitting elements, and GaAlAs, AlInGaP or other similar semiconductor layer can be used as a red light emitting element.
    [0040] The light-emitting element is generally formed by laminating a semiconductor layer onto a growth substrate, such as a sapphire substrate. The growth substrate may have texture on the face that is joined to the semiconductor layer. This intentionally changes the critical angle when light emitted from the semiconductor layer radiates the substrate and allows light to be easily extracted out of the substrate.
    [0041] The growth substrate can be removed from the light-emitting element after lamination of the semiconductor layer. Such removal can be carried out, for example, by polishing, LLO (laser removal), or the like.
    [0042] The light emitting element may have a pair of positive and negative electrodes on the same side. This allows the light emitting element to be flip-chip mounted to a base that has a conductive pattern. In this case, the face that is opposite the face on which the electrode pair is formed becomes the light extraction face. Flipchip assembly involves the use of a metal protrusion such as Au, Cu, a conductive paste shaped junction member such as solder, a thin film junction member, or the like, and the electrical connection of the light emitting element. with the conductive pattern of the base. Alternatively, in face-up assembly, the face on which the electrode pair is formed can serve as the light extracting face.
    [0043] The light emitting element can have the pair of positive and negative electrodes on different sides. In this case, one of the electrodes is connected to the base with a conductive adhesive, and the other electrode is connected to the base with a conductive wire, or similar.
    [0044] A plurality of light-emitting elements are included in a single light-emitting device. The light-emitting elements are arranged, and, for example, they may be arranged in a single row, or they may be arranged in an array. The number of light-emitting elements can be properly selected according to the characteristics, size, and so on, of the light-emitting device to be obtained.
    [0045] The light-emitting elements arranged are preferably close together and, when automotive applications, and especially luminance distribution and so on, are taken into account, the distance between the light-emitting elements can be about 5 to 50% of the length of the longer side of the light emitting elements and preferably about 5 to 30% and more preferably about 5 to 20%. Therefore, arranging the light-emitting elements close together ensures a good and even luminance distribution. As a result, the light emitting device can be used as a planar light source with good emission quality and little emission irregularity. LIGHT REFLECTING MEMBER
    [0046] The light-reflecting member covers the side surfaces of the light-emitting elements. The phrase "the side surfaces of the light-emitting elements" here refers to at least part of the direction of the thickness of the side surfaces of the semiconductor layer and preferably the entire direction of the thickness of the semiconductor layer and/or part of the outer periphery the side surfaces of the semiconductor layer and, more preferably, the entire side surfaces around the exterior of the semiconductor layer. A separate layer of an adhesive, an embedded member, or the like may be interposed between the semiconductor layer and the light-reflecting member on the side surfaces of the light-emitting elements, but it is preferable that the light-reflecting member is in contact with the semiconductor layer. It is preferable that all outer peripheral side surfaces of all light-emitting elements are integrally covered by the light-reflecting member. Consequently, light emitted from the light-emitting elements will be reflected within the light-emitting elements, at the interface between the light-emitting elements and the light-reflecting member. As a result, the light will not be absorbed by adjacent light-emitting elements, and instead will be efficiently emitted outwardly from the upper surfaces of the light-emitting elements. The light-emitting elements can be uniformly arranged and spaced as closely as possible, while allowing a good luminance distribution to be obtained. Also, as discussed above, although the base has channels, it can be easily manipulated as a single light emitting device.
    [0047] The light-reflecting member preferably covers not only the side surfaces of the light-emitting elements, but also at least part of the first main surface of the base. Consequently, as discussed above, the base can be fully configured regardless of whether it is just one or more than one. It is particularly preferable that the light-reflecting member covers the first main surface of the base around the outside of the light-emitting elements. When the channels come to the side of the first main surface of the base, the face of the light-reflecting member on the side of the base between the bases can coincide with the first main surface of the base, or it can be set back to the side of the light-reflecting member.
    [0048] In addition, the base side surface of the light-reflecting member between the bases may be covered by a separate member. For example, when the light-reflecting member or a light-blocking member, or the like, is arranged in a trough, there will be less light scattering to the base side.
    [0049] The light-reflecting member covering the side surfaces of the light-emitting elements, that is, the light-reflecting member disposed between the light-emitting elements, can be flush with the upper surfaces of the light-emitting elements (the faces of light extraction). The term "leveled" here means that some difference in height is allowed, such as about 10% of the thickness of the light-reflecting member and preferably about □5%.
    [0050] When a light transmitting member covering the upper surfaces of the light emitting elements, as discussed below, is additionally provided, the light transmitting member and the light reflecting member are preferably leveled on the side of the upper surface.
    [0051] The length of the light-reflecting member between the light-emitting elements is preferably equal to the distance between the light-emitting elements, such as about 10 to 500 µm, more preferably about 100 to 300 µm and even more preferably about 50 to 200 µm or about 100 to 200 µm. Determining such a length allows the scattering of light from the light-emitting elements to the side of the lateral surface to be kept to a minimum even though the adjacent light-emitting elements are not too far apart. So, the light emitting device can realize more efficient light reflection. As a result, good luminance distribution can be guaranteed.
    [0052] The light-reflecting member is formed of a material that is capable of reflecting light emitted by the light-emitting elements. Therefore, the light emitted by the light-emitting elements can be reflected within the light-emitting elements, at the interface between the light-emitting elements and the light-reflecting member. As a result, light propagates within the light-emitting elements and finally can be emitted outwards on the upper surface of the light-emitting member from the upper surfaces of the light-emitting elements.
    [0053] Also, when the light-emitting elements are independently actuated and the on and off states result between adjacent light-emitting elements, it will be less likely that a light-emitting element will appear to be in a lit state because it is subject to light of a light-emitting element that is lit, even though the light-emitting element is actually in an off state. That is, there will be less light scattering between the light-emitting elements.
    [0054] It is generally preferable that the light-reflecting member includes a resin. The light-reflecting member can be formed using a resin that includes a resin containing at least one type of silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, and acrylic resins, or a hybrid resin and a substance reflector of light. Of these, a resin containing a silicone resin as a base polymer is preferred from the viewpoint of heat resistance, good electrical insulation properties and flexibility. Thus, it is possible to absorb the tension mentioned above due to expansion and contraction of the base.
    [0055] Examples of light-reflecting substance include titanium oxide, silicon oxide, zirconium oxide, magnesium oxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, titanate of potassium, alumina, aluminum nitride, boron nitride and mullite. Of these, titanium oxide is preferred from the standpoint of stability with respect to water and high refractive index.
    [0056] The amount in which the light-reflecting substance is contained can be adjusted accordingly as determined by the target characteristics and so on of the light emitting device, provided that the amount of light reflected and transmitted and so on by the member light reflector can be varied. For example, the amount of the light-reflecting substance may preferably be 15% by weight or more, and more preferably 30% by weight or more with respect to the total weight of the light-reflecting member.
    [0057] The light-reflecting members disposed between the light-emitting elements may additionally include a light-blocking member between the light-reflecting members between the light-emitting elements. Arranging a light blocking member between the light reflecting members between the light emitting elements further reduces the light scattering effect between light emitting elements. Also, light scattering can easily be suppressed, although the distance between light-emitting elements is further reduced.
    [0058] An example of a light blocking member is the light reflecting member mentioned above which contains a light absorbing substance. Examples of light absorbing substances include black pigments and carbon black.
    [0059] As discussed above, when a conductive member such as a wire is arranged to electrically connect the conductive patterns, that conductive member may be embedded in the light-reflecting member. The conducting member preferably is embedded in the light-reflecting member so as not to be exposed on the outer surface of the light-emitting device. This prevents short circuit and other similar problems occurring in the light emitting device caused when the solder or other joining member enters the channel during mounting of the light emitting device to the mounting base, and the member conductor connects with the solder.
    [0060] The light-reflecting member can be a material that has a good heat dissipation property in addition to light reflectivity. The thermal conductivity of the light-reflecting member is preferably 0.2 W/mrK or more, more preferably 1 W/mrK or more, and even more preferably 2 W/mrK or more. Using a material that has high thermal conductivity improves heat dissipation. Examples of this material include boron nitride and aluminum nitride which are of high thermal conductivity.
    [0061] For example, as will be discussed below, when the light transmitting member contains a phosphor, the phosphor can itself generate heat due to phosphorescence, and this heat can reduce optical production efficiency. On the other hand, when the light-reflecting member has a high thermal conductivity, the heat from the phosphor in the light-transmitting member can be efficiently dissipated.
    [0062] The light-reflecting member can be formed by injection molding, potting, resin printing, transfer molding, a compression molding or the like. LIGHT TRANSMITTING MEMBER
    [0063] The light-emitting device also preferably includes a light-transmitting member that covers the upper surfaces of the light-emitting elements (the light-extracting faces) (as shown by 4 in Figures 1A and 1B). The light transmitting member transmits light emitted from the light emitting elements and releases this light to the outside.
    [0064] The light transmitting member preferably covers all the upper surfaces of the light-emitting elements so that all light emitted from the light-emitting elements is extracted. However, the more the light-transmitting member is larger than the light-emitting elements, the lower the luminance of the extracted light can be. Therefore, the light transmitting member covering the light-emitting elements is preferably of the same size as the light-emitting elements, as far as this is possible. This produces higher luminance in addition to allowing the light emitting device to be even smaller in size.
    [0065] When a plurality of light-emitting elements are covered by individual light-emitting members that are larger than the light-emitting elements, it is preferable that the distance between the light-emitting members is smaller than the size of the members themselves light transmitting (the length along one side) and, more preferably, that this distance be no more than 20% of the size of the light transmitting members themselves. Thus, arranging the light transmitting members close together provides a light emitting device which is a planar light source with high emission quality and little emission irregularity.
    [0066] The light transmitting members may integrally cover the plurality of light-emitting elements, or may individually cover the plurality of light-emitting elements.
    [0067] The light transmitting members that individually cover the plurality of light-emitting elements preferably have their side surfaces covered by the light-reflecting member, just as with the light-emitting elements. Consequently, when the light-emitting elements are independently actuated and the on and off states result between adjacent light-emitting elements, it is less likely that a light-emitting element will appear to be in a lit state because it is subject to light from one element. light emitting element is on, although the light emitting element is actually in an off state. That is, there will be less light scattering between the light-emitting elements.
    [0068] The outer faces of the light transmitting member integrally covering the plurality of light-emitting elements need not be covered by the light-reflecting member, but rather are covered taking into account the scattering of light from the faces external.
    [0069] The upper surface side of the light transmitting member preferably is flush with the light reflecting member. This reliably prevents interference between light emitted from the side surfaces of the light transmitting member. This also reliably prevents light interference with respect to an adjacent unlit light-emitting element. The thickness of the light transmitting member can be around 50 to 300 µm, for example.
    [0070] The upper surface of the light transmitting member may have a convex and concave shape, a curved surface, a lens shape or any of a variety of other shapes, and its bottom face preferably is parallel to the faces of extraction of light from the light-emitting elements.
    [0071] An example of the material that forms the light transmitting member includes a glass material such as silica glass, borosilicate glass, quartz glass; resin such as silicone resins, modified silicone resins, epoxy resins, phenolic resins, polycarbonate resins, acrylic resins, trimethylpentene resin, polynorbornene resin and hybrid resins containing at least one such resin; and sapphire. The higher the transparency of the light-transmitting member, the more easily light will be reflected at the interface with the light-reflecting member, so that the luminance can be increased.
    [0072] The light transmitting member may have a phosphor, a light scattering material, or the like. The phosphor or light diffusing material may be contained within the light transmitting member, or a layer containing a phosphor or light diffusing material may be provided to one or both sides of the light transmitting member. Examples of the method for forming the layer containing a phosphor or a diffusing material may include spraying, electroplating and electrostatic coating. Alternatively, a phosphor sheet or the like composed of a material in which a phosphor is dispersed in a resin can be attached to the light transmitting member.
    [0073] The phosphor that converts light into light of a different wavelength by absorbing the light emitted from the light emitting element is selected. Like phosphorus, one known in the art can be used. Examples include yttrium-aluminum-garnet (YAG) based phosphors activated by cerium, lutetium-aluminum-garnet (LAG) based phosphors activated by cerium, phosphors based on calcium aluminosilicate nitrogen containing (CaO-Al2O3-SiO2) activated by europium and /or chromium, silicate-based phosphors ((Sr, Ba)2SiO4) activated by europium, D-sialon phosphors, chlorosilicate-based phosphors and nitride-based phosphors, such as CASN-based or SCASN-based phosphors, based phosphors in rare earth metal nitride, oxynitride based phosphors, KSF based phosphors (K2SiF6:Mn) and sulfide based phosphors.
    [0074] Consequently, there can be provided a light emitting device that emits mixed color light (e.g. white light) of primary light and secondary light with a visible wavelength, and a light emitting device that is excited by light ultraviolet light to emit secondary light with a visible wavelength. Phosphorus can be used in combination with plural types of matches. With the use of a suitable target blending and composition ratio in the color tone, it is possible to adjust the color output and color reproducibility.
    [0075] When the phosphor is included in the light transmitting member, the amount of the phosphor is, for example, preferably about 5 to 50% by weight with respect to the total weight of the light transmitting member.
    [0076] When the light emitting device having a plurality of light transmitting members, it may be phosphors of different type and quantity to be contained in each of the plurality of light transmitting members.
    [0077] With the use of combinations of transmitting members that contain the different types or combinations of phosphors, it is possible to adjust the color production and color reproducibility that are suitable for the desired color tone.
    [0078] The phosphor can be a luminescent material referred to as a so-called nanocrystal or quantum dot. Examples of the material thereof include nano-sized high dispersion particles of semiconductor materials, for example semiconductors from groups II to VI, groups III to V and groups IV to VI, more specifically CdSe, core-shell type CdSXSe1-X/ZnS, GaP and InAs. For example, such a phosphor has a particle size of about 1 to 100 nm, preferably of about 1 to 20 nm (the number of atoms: about 10 to 50). Using this phosphor, the internal scattering can be suppressed so that the light transmittance can be further improved. By suppressing the internal scattering, and light scattering of converted color light, the light transmission efficiency can be further improved.
    [0079] An organic light-emitting material can be used as the phosphor material. A typical example of an organic light-emitting material is a light-emitting material in which an organometallic complex is used, and there are many light-emitting materials with high light transmittance. Therefore, when an organic light-emitting material is used as the phosphor material, the same effect can be obtained as when using a quantum dot phosphor.
    [0080] Examples of light scattering material include silica, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, titanate of barium, aluminum oxide, iron oxide, chromium oxide, manganese oxide, glass, carbon black and the like.
    [0081] The light transmitting member is joined so as to cover the upper surfaces of the light-emitting elements (the light extracting face). Bonding can be effected, for example, by pressure fitting, sintering, bonding with a known adhesive such as an epoxy or silicone, bonding with an organic adhesive having a high refractive index, or bonding with low melting glass.
    [0082] When the light transmitting member and the light emitting elements are joined with an adhesive, the adhesive may contain the phosphor or light diffusing material mentioned above.
    [0083] When the light transmitting member is joined so as to cover the upper surfaces of the light-emitting elements, and particularly when using a light-emitting member that is larger than the light-emitting elements, an adhesive can be arranged per all the way from the side surfaces of the light-emitting element so that light from the light-emitting elements can more easily propagate to the light-emitting member. In that case, the adhesive will end up being disposed between the light-reflecting member and the semiconductor layer of the light-emitting elements. However, the adhesive is preferably not disposed on the outside directly under the light transmitting member. This prevents color irregularity and allows light to be properly reflected and propagated between the light-emitting elements and the light-reflecting member. BUILT-IN MEMBER
    [0084] When the light-emitting elements are joined at the base, preferably a recessed member is disposed between the base and the light-emitting elements. Having a recessed member between the base and the light-emitting elements improves heat dissipation by absorbing any voltage that results from the difference in thermal expansion coefficient between the light-emitting elements and the base.
    [0085] The embedded member can be disposed only directly under the light-emitting elements, or it can extend directly under the light-emitting elements to between the light-emitting elements, or it can be in contact with part of the side surfaces of the elements light emitters. The embedded member may have a thickness of about a few microns to a few hundred microns at the thickest part, for example.
    [0086] The embedded member is what is called an underfill, generally includes a resin, and preferably is formed of a light-reflecting resin. Using a light-reflecting resin allows the light emitted downwards by the light-emitting elements to be reflected, and improves luminous flux.
    [0087] The embedded member may be formed of the same material as the light-reflecting member, or it may be formed of a different material. It is particularly favorable to use a material whose elasticity and/or linear expansion is less than that of the light-reflecting member. This makes it possible to moderate the expansion/contraction tension of the resin at the joint between the light-emitting elements and the base and improves the reliability of the electrical connection. In that case, it is preferable to use a material with high mechanical strength for the light-reflecting member, and for the recessed member to be completely covered by the light-reflecting member, so that the recessed member is not exposed to the outside. This ensures resistance to external stress on the light-emitting elements and the recessed member.
    [0088] When the embedded member and the light-reflecting member are made of different materials, it is preferable to cure the embedded member before embedding it in the light-reflecting member. This prevents the resins from mixing, so the performance of each resin is not lost.
    [0089] The embedded member can be formed using a resin that includes a resin containing at least one of silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, acrylic resins, urea resins, fluorine resins or a hybrid resin thereof, and a light-reflecting substance. Of these, a resin containing a silicone resin, epoxy resin, etc. as a base polymer, it is preferred.
    [0090] Examples of the light-reflecting substance include titanium oxide, silicon oxide, zirconium oxide, magnesium oxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, titanate of potassium, alumina, aluminum nitride, boron nitride and mullite. This makes it possible to reflect light effectively.
    [0091] The material that makes up the embedded member can be a single type, or a combination of two or more types. This allows the light reflectivity to be adjusted, and also makes it possible to adjust the resin's coefficient of linear expansion.
    [0092] A Zener diode or other similar protective element may be mounted in the light emitting device of the present invention. For example, embedding a shielding element in the light-reflecting member prevents a decrease in light extraction caused by absorption of light from the light-emitting elements by the shielding element, or blocking of light by the shielding element. METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
    [0093] The light emitting device mentioned above can be manufactured by the following method.
    [0094] A base is provided that has conductive patterns on a first main surface and a second main surface on the opposite side to the first main surface.
    [0095] A plurality of light-emitting elements is mounted in the conductive pattern on the first main surface.
    [0096] A light-reflecting member that integrally covers the side surfaces of the light-emitting elements is formed.
    [0097] At least one channel is formed in the second main surface of the base to correspond to a space between the light-emitting elements.
    [0098] Furthermore, a light transmitting member can be disposed on the upper surfaces of the light-emitting elements. This step can be carried out before or after the light-emitting elements are mounted on the base, or it can be carried out so that part of the light transmitting member covers or does not cover the upper surface of the light-reflecting member after it has been formed.
    [0099] An embodiment of the light emitting device of the present invention will now be described in detail by referring to the drawings. MODE 1
    [00100] As shown in Figures 1A and 1B, this light emitting device 10 includes a base 2 having conductive patterns 3a and 3b; two light-emitting elements 1; and a light-reflecting member 5.
    [00101] The base 2 is formed by a ceramic plate made of aluminum nitride with a thickness of about 400 µm and a thermal conductivity of 170 W/m^k.
    [00102] The base 2 has a channel that starts from the second main surface and goes to the first main surface. That is, the base is divided into a plurality of sections. The width of channel 2a is about 100 µm. Base 2 has conductive patterns 3a and 3b which are corresponding to a positive and negative pair formed on the first main surface and the second main surface respectively by vapor deposition of titanium, platinum or gold. The conductive pattern 3a on the first main surface and the conductive pattern 3b on the second main surface opposite the first main surface are electrically connected via this pathway 3c.
    [00103] The light emitting elements 1 are produced by laminating a semiconductor layer onto a sapphire substrate and forming a pair of positive and negative electrodes on the same side. Each of the light emitting elements 1 is flipchip mounted with a protrusion composed of gold, in the conductive pattern 3a of the first main surface of each base 2. Therefore, the sapphire substrate serves as the light extracting face.
    [00104] The upper surfaces of the light-emitting elements are covered by plate-shaped light-transmitting members 4 made of glass n which YAD is dispersed. The light transmitting members 4 contain from 5 to 15% by weight of YAG phosphorus. The size is 1.15mm*1.15mm*0.18mm (thickness). The light-transmitting members 4 are bonded to the upper surfaces of the light-emitting elements 1 by thermosetting an adhesive composed of a silicone resin.
    [00105] The distance between adjacent light-emitting elements 1 is about 0.5 mm, or about 50% of the length of the longest side of the light-emitting elements 1. The distance between adjacent light-emitting members 4 is about 0.4 mm.
    [00106] The outer periphery of these, including the side surfaces of the light-emitting elements 1 and the side surfaces 4a of the light-transmitting members 4 that cover the upper surfaces of the light-emitting elements 1, is covered by the light-reflecting member 5. The light-reflecting member 5 is disposed directly under the light-emitting elements 1, and also in regions opposite the conductive pattern 3a or the bases 2. The light-reflecting member 5 integrates the light-emitting elements 1, the bases 2, and to the light transmitting members 4.
    [00107] The light-reflecting member 5 contains 30% by weight of titanium oxide in a silicone resin, and its thermal conductivity is about 0.2 W/m^k. The light-reflecting member 5 is flush with the light-transmitting members 4 on the upper surfaces of the light-emitting elements 1.
    [00108] This light emitting device can be manufactured by the following method.
    [00109] First, as shown in Figure 6A, a flat base 2 that has conductive patterns 3a and 3b on the first main surface and the second main surface are prepared.
    [00110] Step 1: As shown in Figure 6B, a plurality of light-emitting elements 1 are mounted on the conductive pattern 3a on the first main surface of the base 2, and electrical connections are made.
    [00111] Step 2: Then, as shown in Figure 6C, the light-transmitting members 4 are respectively bonded with an adhesive to the upper surfaces of the light-emitting elements 1. Thereafter, as shown in Figure 6D, the side surfaces of the elements light-emitting members 1 and the side surfaces 4a of the light-transmitting members 4 are integrally covered by the light-reflecting member 5. The upper surface of the light-reflecting member 5 here can be flush with the light-extracting faces of the light-transmitting members. 4, or lower than the light extracting faces. This coating can be carried out by potting, compression molding, transfer molding, or the like.
    [00112] The connection of the light-emitting member 4 to the light-emitting elements 1 can be carried out before the light-emitting elements 1 are mounted on the base 2, or it can be carried out after the side surface 4a of the light-emitting elements 1 is covered with light-reflecting member 5.
    [00113] Step 3: Next, a blade or similar is used to make a cut on the second side of the main surface of the corresponding location of the base 2 so as to match in position between the light emitting elements. Here, the groove 2a is formed, as shown in Figure 1B, by making a cut to the same depth as the thickness of the base 2. The depth of the cut here is preferably a depth that reaches the first main surface of the base 2, and preferably does not extend to the light-reflecting member 5. This serves to prevent the light-reflecting member 5 from becoming a partial thin film and to prevent light from leaking from that location.
    [00114] Step 4: The light emitting device is separated into the targeted constituent units (two light emitting elements in this case) with the use of a blade.
    [00115] Thereafter, as shown in Fig. 1C, for example, electrical connections are made to a composite solder junction member on a mounting plate that has a patterned circuit on its surface so that the product can be used in a variety of applications.
    [00116] Generally, when such a light emitting device is formed, a composite base is used in which a plurality of constituent units of a single light emitting device are integrally provided. When ease of work is taken into account in the above-mentioned method for manufacturing a light emitting device, steps 1 and 2 are carried out for a composite base, but step 4 is not limited to coming after step 3, and may , instead, be performed before step 3.
    [00117] Thus, the two emitting surfaces (light-emitting elements) contained by a single light-emitting device can be mounted in high density on a mounting plate through the following number of steps: mount the light-emitting elements in a composite board (twice), separate into individual light emitting devices in a state in which two light emitting elements are turned on (once), and assemble a light emitting device in which two light emitting elements are turned on a mounting plate (once).
    [00118] Since the number of steps can be reduced when compared to a conventional process that involves assembling light-emitting elements on a composite board (twice), separating the composite board into individual units (twice), and mounting the individual light emitting devices on a mounting plate (twice), the positional accuracy of the emitting surfaces on the mounting plate can be significantly improved. This is due to the fact that, when steps are added, the variation in each of the steps (in the assembly accuracy of the light-emitting elements, the cutting accuracy during separation into units, and the assembly accuracy for each light-emitting device individual light) increases the amount of positional variation on the emission surfaces in assembly as a finished product.
    [00119] Thus, in the process of separating into units and in the process of assembling a light-emitting device on a mounting plate, where variation in accuracy is expected to occur, when variation in each step can be avoided or reduced, the result will be a light-emitting device with higher reliability, without discontinuity, short circuit, or other such problems, and in which good luminance distribution, heat dissipation and similar resistance are guaranteed, while the plurality of surfaces is guaranteed. of emission (light-emitting elements) is arranged evenly and as close as possible. MODE 2
    [00120] As shown in Fig. 2, this light-emitting device 20 has a channel 2b formed only part of the way in the direction of the base thickness from the second side of the main surface of the base 2. That is, the base 2 it has channel 2b that does not reach the first main surface of base 2, which means that the configuration is the same as in light emitting device 10, except that base 2 is shaped to be connected as a single member. .
    [00121] The light emitting device 20 has the same effect as the light emitting device 10.
    [00122] In addition, the base 2 has the channel 2b and is connected in the direction of the thickness of the base 2, but this connection can be easily separated by the tension produced by expansion or contraction of the light-emitting elements themselves, the base itself, and /or the join member itself. This allows tension to be easily absorbed or moderated. MODE 3
    [00123] As shown in Fig. 3, such light emitting device 30 includes a base 12 having a plurality of conductive patterns; a plurality of light-transmitting members, a plurality of light-emitting elements 1 covered by the light-transmitting member 4, and a light-reflecting member 5. The light-emitting elements 1 are arranged in a matrix. In that case, the channels 12a in the base 12 are formed in a lattice shape so as to surround the light-emitting elements, between the light-emitting elements that are arranged in a matrix. The channels 12a include channels that extend in columns and channels that extend in rows, and the widths of these may be different, but taking into account the ease of working during formation of the channels, preferably the widths are the same.
    [00124] Generally, the configuration of the emitting surfaces of each light emitting device on a mounting plate is determined according to the light distribution design, so when the various light emitting devices are mounted on a mounting plate, so when there is too much positional variation in the emission surfaces of light emitting devices mounted on a mounting plate, the desired light distribution pattern cannot be formed.
    [00125] On the other hand, with the light emitting device in this mode, since it is possible to significantly reduce the positional variation in the emission surfaces contained by the light emitting device, the assembly can be performed so that the position and orientation of the emission surfaces are as intended and in accordance with the intended light distribution design, and the above-mentioned effect can be obtained effectively.
    [00126] In addition, when the light-emitting elements are arranged in a matrix and channels are provided in a truss shape at the base, the light-emitting device can have flexibility, and this allows it to be mounted on mounting plates in any way desired. SEPARATION ASSESSMENT
    [00127] The illumination defect rate after a heat cycle test was examined in order to test the separation of the light emitting device that belongs to an embodiment of the present invention. The light emitting devices used for this measurement included 1a) a sample in which the base was separated between the light emitting elements of a light emitting device in which five light emitting elements were connected in a single line, 1b) a sample in which the base was separated between the light emitting elements of a light emitting device in which ten light emitting elements were connected in a single line, 1c) a sample in which the base was separated between the light emitting elements of a light emitting device in which five lines of ten light emitting elements each (5 x 10) have been connected, 2a) a sample in which five light emitting elements have been connected in a single line, 2b) a sample in which ten emitting elements of light were connected in a single line, and 2c) a sample in which five lines of ten light emitting elements each were connected.
    [00128] As shown in Figure 1C, these light-emitting devices were electrically connected by a composite solder junction member to a mounting plate that has a pattern circuit on its surface, a charge was applied per heat cycle in which the temperature was repeatedly changed between -40 °C and 125 °C, and the occurrence of non-illumination was checked for each sample. As a result, after going through 400 test cycles, no cases of non-illumination were found in samples 1a, 1b, and 1c, in which the base portions were separated between light-emitting elements. As for the samples in which the bases were attached, no illumination occurred at 0 of 14 samples in case 2a, 3 of 10 samples in case 2b, and 6 of 6 samples in case 2c. After going through 560 test cycles of the samples in which the bases were bound it was confirmed that the non-illumination happened in 9 out of 10 in case 2b) increased by 6 samples. No cases of non-illumination were seen in samples 1a, 1b, and 1c, in which the base portions were separated between the light emitting elements. Furthermore, after going through 1040 test cycles, no cases of non-illumination were seen in samples 1a, 1b, and 1c, in which the base portions were separated between the light-emitting elements. As for the samples in which the bases were attached, non-illumination occurred in 6 out of 14 samples in case 2a, 9 out of 10 samples in case 2b, and 6 out of 6 samples in case 2c.
    [00129] Thus, with the light emitting device that belongs to an embodiment of the present invention, it is considered that joint defect caused when the base expands and contracts in response to temperature changes can be reduced by channels between the bases. It is also confirmed that the larger the base, the greater the number of junction defects that are caused by temperature changes.
    [00130] Assembling a plurality of light-emitting elements makes it possible to design the emission surfaces in the desired shape according to the way the light-emitting elements are arranged, and this allows wider application. Due to the fact that the base on which the light-emitting elements are mounted has a channel and the base is separate, small movements, warping, and so on, are possible in the base itself. Consequently, expansion and contraction of the base (the conductive pattern and/or the base body) attributable to heat generated by the individual light-emitting elements, thermal hysteresis during assembly, and so on, expansion and contraction of the member junctions connecting the light-emitting elements and the base, and the like, can be absorbed or released into individual base units. As a result, joint defects, such as separation and the like, between materials attributable to the expansion and contraction inherent in the materials making up the light-emitting elements, the base, the joint member, and so on, can be prevented.
    [00131] That is, even with a light-emitting device that is relatively large in size, an inter-base channel allows thermal expansion and contraction between the light-emitting elements, the base body, the junction member, the plate assembly, and so on, caused by heat cycling, are effectively absorbed or released, which ensures better reliability. MODE 4
    [00132] As shown in Figures 4A to 4C, this light emitting device 40 includes bases 22a, 22b, 22c which have conductive patterns 33a; a plurality of light-emitting elements 1 respectively mounted on the conductive patterns 33a; a plurality of light-transmitting members 4 which respectively cover each of the light-emitting elements; a light-reflecting member 5 integrally covering the side surfaces of the light-emitting elements; and a protective element 35.
    [00133] The bases 22a, 22b, and 22c are separated by channels, and the conductive patterns 33a of the bases 22a, 22b, 22c are electrically connected by wires 34. The wires 34 are embedded in the light-reflecting member 5 so as not to be exposed on the outer surface of the light emitting device 40. The light emitting device 40 is formed integrally with the light reflecting member 5 and the wires 34.
    [00134] The bases 22a and 22c, which are disposed at either end of the light-emitting device, have conductive patterns on the second main surface on the opposite side to the first main surface. The conductive patterns 33b are electrically connected via pathways 3c embedded in the base body to the conductive pattern 33a on the first main surface and function as the external electrodes of the light emitting device 40.
    [00135] The base 22b in the middle of the light emitting device 40 has a heat dissipation pattern 33c which is electrically independent of the conductive member 32a on the first main surface and the plurality of light emitting elements.
    [00136] The rest of the configuration is the same as that of the light emitting device 10.
    [00137] With this configuration of the light emitting device 40, the conductive patterns 33a and 33b function as a pair of external electrodes for the light emitting device 40, and the plurality of light emitting elements can be actuated all at once. Also, since the heat dissipation pattern 33c, which has no electrical potential, can be arranged on the second side of the main surface of the bases 22b, a light emitting device with particularly good heat dissipation can be obtained. In general, more heat tends to be trapped closer to the center of a light emitting device, so with a light emitting device that includes a plurality of light emitting elements, superior heat dissipation can be achieved by providing a pattern of Specialized heat dissipation to dissipate heat in the region directly under the light-emitting element disposed near the center of the light-emitting device. From a heat dissipation point of view, preferably the heat dissipation pattern is larger than the light emitting element disposed directly above in plan view. Furthermore, it is preferable that the outer edge of the light emitting element is included within the heat dissipation pattern in flat view.
    [00138] Three light emitting elements are included in the light emitting device 40 as shown in Figures 4A to 4C, but the number of light emitting elements is not limited to three, and may instead be four or more . More than four light emitting elements can be arranged in an array as with the light emitting device 30 of Figure 3.
    [00139] When a plurality of light-emitting elements are arranged in an array as shown in Figure 3 and are triggered all at once, more heat tends to get trapped closer to the center of a light-emitting device, and the dissipation of heat can be decreased. In response to this, in particular the region directly under the light emitting element located in the center of the light emitting device can be given a specialized pattern for heat dissipation, which has no electrical potential, this ensures good heat dissipation in the center of the light emitting device.
    [00140] Additionally, the channel between bases allows the thermal expansion and contraction between the light-emitting elements, the base body, the joining member, the mounting plate, and so on, caused by heat cycling to be absorbed or released effectively, which ensures better reliability. MODE 5
    [00141] As shown in Figure 5, this light emitting device 50 has a light transmitting member integrally disposed in a plurality of light emitting elements.
    [00142] The rest of the configuration is the same as that of the light emitting device 40.
    [00143] With the configuration of this light emitting device 50, a planar emitting light emitting device can be obtained with which a plurality of light emitting elements can be actuated all at once and there is a large emission surface area . INDUSTRIAL APPLICABILITY
    [00144] The light emitting device of the present invention can be used for various types of light sources for luminaires, indicators, displays, backlight of liquid crystal displays as well as light sources that equip a vehicle, signs, products of vehicle, display devices such as advertisements, in particular it is preferable to use for a light source that equips a vehicle such as headlamp, tail lamp, daytime running lights (DRL) and the like.
    [00145] It should be understood that although the present invention has been described with respect to preferred embodiments thereof, various other embodiments and variants may occur to persons skilled in the art, who are within the scope and spirit of the invention, and these other embodiments and variants are intended to be covered by the following claims.
    权利要求:
    Claims (14)
    [0001]
    1. A light-emitting device (10, 20, 30, 40) comprising: a plurality of light-emitting elements (1), a base (2, 22a, 22b, 22c) having a first main surface and a second main surface on the side opposite the first main surface, wherein the base (2, 22a, 22b, 22c) has conductive patterns (3a, 33a) disposed on the first main surface on which said plurality of light-emitting elements ( 1) are mounted, and conductive patterns (3b, 33b) arranged on the second main surface, characterized in that a channel (2a, 2b) is provided on the second main surface of the base (2, 22a, 22b, 22c) which corresponds to a space between the light-emitting elements (1), the channel (2a, 2b) reaching the first main surface of the base (2, 22a, 22b, 22c), a light-reflecting member (5) integrally covers side surfaces of the plurality of light-emitting elements (1).
    [0002]
    2. Light emitting device according to claim 1, characterized in that the base (2, 22a, 22b, 22c) includes a base body formed on the basis of an insulating material whose thermal conductivity is higher than that of the light-reflecting member (5), that of the conductive patterns (3a, 33a) disposed on the first main surface of the base, and that of the conductive patterns (3b, 33b) disposed on the second main surface of the base.
    [0003]
    3. Light-emitting device according to claim 2, characterized in that the base body is composed of ceramic.
    [0004]
    4. Light-emitting device according to any one of claims 1 to 3, characterized in that the light-emitting elements (1) are arranged in a matrix.
    [0005]
    5. A light-emitting device according to any one of claims 1 to 4, characterized in that it additionally comprises a light transmitting member (4, 44) that covers an upper surface of at least one of the light-emitting elements. light (1), a side surface of the light transmitting member (4, 44) which is covered by the light reflecting member (5).
    [0006]
    6. A light-emitting device according to any one of claims 1 to 5, characterized in that the light-reflecting member (5) includes a resin, or covers the side surfaces of the light-emitting elements (1) and by the minus a part of the first main surface of the base (2, 22a, 22b, 22c).
    [0007]
    7. Light emitting device according to claim 5 or 6, characterized in that the light transmitting member (4, 44) and the light reflecting member (5) are leveled on one side of the upper surface.
    [0008]
    8. A light-emitting device according to any one of claims 1 to 7, characterized in that the distance between the light-emitting elements (1) is about 5 to 50% of the length of the longest side of the light-emitting elements (1).
    [0009]
    9. A light-emitting device according to any one of claims 1 to 8, characterized in that at least one base (22a, 22b, 22c) has a heat dissipation pattern (33c) disposed on the second main surface , and the light emitting device further comprises conductive members (34) which electrically connect conductive patterns (33a, 33b) disposed on the plurality of bases (22a, 22b, 22c).
    [0010]
    10. Light-emitting device according to claim 9, characterized in that the conductive members are embedded in the light-reflecting member (5).
    [0011]
    11. Light emitting device according to claim 10, characterized in that the heat dissipation pattern is electrically separated from the conductive members.
    [0012]
    12. Light-emitting device according to any one of claims 1 to 11, characterized in that the plurality of light-emitting elements (1) is activated all at once.
    [0013]
    13. Method for manufacturing a light-emitting device according to any one of claims 1 to 12, characterized in that it comprises: providing a base (2, 22a, 22b, 22c) having a first main surface and a second main surface on the side opposite the first main surface, wherein the base (2, 22a, 22b, 22c) has conductive patterns (3a, 33a) arranged on the first main surface, conductive patterns (3b, 33b) arranged on the second surface main, mount a plurality of light-emitting elements (1) in the conductive patterns (3a, 33a) on the first main surface, form a light-reflecting member (5) which integrally covers the side surfaces of the light-emitting elements ( 1), and form at least one channel (2a, 2b) in the second main surface of the base (2, 22a, 22b, 22c) corresponding to a space between the light-emitting elements (1), said at least a channel reaching the first main surface 1 of the base (2, 22a, 22b, 22c).
    [0014]
    14. Method for manufacturing a light emitting device according to claim 13, characterized in that it further comprises forming a light transmitting member (4, 44) on an upper surface of the light emitting elements (1).
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    同族专利:
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    US20170179360A1|2017-06-22|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US7273987B2|2002-03-21|2007-09-25|General Electric Company|Flexible interconnect structures for electrical devices and light sources incorporating the same|
    US6791116B2|2002-04-30|2004-09-14|Toyoda Gosei Co., Ltd.|Light emitting diode|
    JP2004200253A|2002-12-17|2004-07-15|Matsushita Electric Works Ltd|Light-emitting device|
    US20040188696A1|2003-03-28|2004-09-30|Gelcore, Llc|LED power package|
    CN2692479Y|2004-01-19|2005-04-13|上海华翔电子光源有限公司|High strength light source device|
    JP3877731B2|2004-02-23|2007-02-07|シャープ株式会社|Sealed light source device and video display device using the same|
    KR100867970B1|2004-10-04|2008-11-11|가부시끼가이샤 도시바|Light emitting device, lighting equipment, or liquid crystal display device using such light emitting device|
    US7772609B2|2004-10-29|2010-08-10|Ledengin, Inc. |LED package with structure and materials for high heat dissipation|
    US7952112B2|2005-04-29|2011-05-31|Philips Lumileds Lighting Company Llc|RGB thermal isolation substrate|
    CN101213661A|2005-06-29|2008-07-02|皇家飞利浦电子股份有限公司|Package, subassembly and methods of manufacturing thereof|
    JP2007335734A|2006-06-16|2007-12-27|Renesas Technology Corp|Semiconductor device|
    CN200979109Y|2006-09-29|2007-11-21|堤维西交通工业股份有限公司|LED lamp set improved structure|
    JP2008294309A|2007-05-25|2008-12-04|Showa Denko Kk|Light emitting device and display device|
    KR101517644B1|2007-11-29|2015-05-04|니치아 카가쿠 고교 가부시키가이샤|Light-emitting device and its manufacturing method|
    JP2009212134A|2008-02-29|2009-09-17|Toshiba Corp|Aluminum nitride package, light-emitting device, backlight, and lighting equipment|
    JP5241411B2|2008-09-29|2013-07-17|京セラ株式会社|Light emitting device substrate, light emitting device and lighting device using light emitting device|
    JP5521325B2|2008-12-27|2014-06-11|日亜化学工業株式会社|Light emitting device and manufacturing method thereof|
    JP2010238941A|2009-03-31|2010-10-21|Sanyo Electric Co Ltd|Light emitting device|
    JP5349167B2|2009-06-26|2013-11-20|シチズンホールディングス株式会社|Manufacturing method of LED light source device|
    EP2470952B1|2009-08-27|2016-02-10|LG Electronics Inc.|Backlight unit and display device|
    US8183579B2|2010-03-02|2012-05-22|Taiwan Semiconductor Manufacturing Company, Ltd.|LED flip-chip package structure with dummy bumps|
    JP5337105B2|2010-06-03|2013-11-06|株式会社東芝|Semiconductor light emitting device|
    US9153545B2|2010-12-20|2015-10-06|Rohm Co., Ltd.|Light-emitting element unit and light-emitting element package|
    JP2013016588A|2011-07-01|2013-01-24|Citizen Electronics Co Ltd|Led light-emitting device|
    JP5533830B2|2011-09-27|2014-06-25|豊田合成株式会社|Linear light source device|
    JP6015004B2|2012-01-05|2016-10-26|日亜化学工業株式会社|LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD|
    JP2013239644A|2012-05-16|2013-11-28|Toshiba Corp|Semiconductor light emitting device|
    US9818919B2|2012-06-11|2017-11-14|Cree, Inc.|LED package with multiple element light source and encapsulant having planar surfaces|
    DE102012110774A1|2012-11-09|2014-05-15|Osram Opto Semiconductors Gmbh|Optoelectronic semiconductor device|KR20170011059A|2015-07-21|2017-02-02|엘지이노텍 주식회사|Unified light emitting Package and automobile lamp using the same|
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    DE102016108427A1|2016-05-06|2017-11-09|Epcos Ag|Multi-LED system|
    US10641437B2|2016-06-30|2020-05-05|Nichia Corporation|LED module|
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    US10546985B2|2017-03-28|2020-01-28|Nanosys, Inc.|Method for increasing the light output of microLED devices using quantum dots|
    EP3396725B1|2017-04-25|2021-01-13|Nichia Corporation|Light emitting device and method of manufacturing same|
    CN108807652A|2017-04-28|2018-11-13|日亚化学工业株式会社|Light-emitting device|
    JP2019048649A|2017-09-08|2019-03-28|日亜化学工業株式会社|Carrier tape and package|
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    CN109904295B|2019-03-21|2020-06-09|京东方科技集团股份有限公司|LED device, manufacturing method thereof and display panel|
    WO2021002158A1|2019-07-04|2021-01-07|日亜化学工業株式会社|Method for manufacturing light emitting device and method for manufacturing light emitting module, and light emitting device and light emitting module|
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    DE102019218501A1|2019-11-28|2021-06-02|OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung|COMPONENT FOR A DISPLAY AND METHOD FOR MANUFACTURING A COMPONENT|
    法律状态:
    2016-08-09| B03A| Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette]|
    2018-10-30| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2020-04-22| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2020-10-13| B07A| Technical examination (opinion): publication of technical examination (opinion) [chapter 7.1 patent gazette]|
    2021-06-15| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2021-08-10| B16A| Patent or certificate of addition of invention granted|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 22/06/2015, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    JP2014133025|2014-06-27|
    JP2014-133025|2014-06-27|
    JP2015099116A|JP6519311B2|2014-06-27|2015-05-14|Light emitting device|
    JP2015-099116|2015-05-14|
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